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Relife RL-088 Universal Magnetic Base for Mobile Phone BGA Soldering

  • Tin-planted universal magnetic fixture
  • High-temperature resistance
  • Strong magnetic adsorption
  • Double-sided use
  • Waterproof & Oil-proof

Rs.698.00 Rs.899.00

Relife RL-088 Tin-planted Universal Magnetic Base for Mobile Phone BGA Soldering Repair


  • RL-088 tin-planted universal magnetic fixture, say goodbye to paper towel planting tin, which can be used for chip positioning and adhesive removal, and strong magnetic adsorption for tin planting
  • It has the characteristics of anti-static, strong magnetic adsorption, high-temperature resistance, steel plate weight gain, chemical corrosion resistance, etc
  • Multifunctional double-sided double-use, it is suitable for repairing motherboards of different shapes, general tin planting of various BGA chips, etc
  • Front side – suitable for all kinds of BGA chips; Reverse side – suitable for different shapes of motherboards
  • Various types of tin-planting stencils are commonly used, which can effectively avoid the phenomenon of tinning on the bottom of the stencil due to heating and swelling
  • Multifunctional position adjustment, decompression protection, tin planting automatically balances the stencil and decompress it, effectively protecting the chip and making it safer
  • New silicone material, high-temperature resistance without bulging, flame retardant, corrosion resistance
  • Insulating material, with good anti-collision / anti-skid / anti-acid properties, and wear-resistant and easy to clean
  • Embedded high-temperature magnets, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetism unchanged
  • High hardness weight-added steel, strong anti-deformation ability, high-quality carbon steel material, not afraid of corrosion


SKU: RL-088 Categories: , ,
Weight 0.350 kg
Dimensions 10 × 10 × 5 cm
Weight 0.150 KG


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