Fonekong, Mobile Repair Tools, Paste
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Fonekong Solder Paste 183°
Fonekong Solder Paste 183° buy from www.gsm24seven.com.
₹299.00 ₹399.00
Fonekong Solder Paste 183°
DESCRIPTION:
Temperature: 183ā FONEKONG
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
Feature :
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Excellent capacity of solder-stickiness
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Excellent Anti-wet Capacity
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Widely used on BGA, PGA, CSP packages and flip chip operation
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Suitable for multiple PCB reflow
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No-clean and Lead free for environmental protection
| Weight | 0.100 kg |
|---|---|
| Dimensions | 8 × 5 × 5 cm |
| Weight | 0.040 kg |
|---|---|
| Color | As picture shown |
| Size | Approx. 1.30*1.30*1.14inch / 3.3*3.2*2.9cm |
| Type | XG50 |
| Alloy | Sn63/Pb37 |
| Microns | 25-45um |
| Material | Plastic +solder paste |
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